製品情報

H252-Z12 (rev. 100)

製品種別 サーバ
CPU  
筐体サイズ 2U
電源仕様 リダンダント電源
用途/特長   
製品説明

製品仕様

Dimensions (WxHxD, mm) 2U 4 Nodes - Rear access
440 x 87.5 x 695
Motherboard MZ12-HD0
CPU AMD EPYC™ 7002 series processor family
Single processor, 7nm technology
Up to 64-core, 128 threads per processor
TDP up to 225W, cTDP up to 240W

Conditional support 280W
Non-supported M.2 devices if using 280W CPU

Compatible with AMD EPYC™ 7001 series processor family
Socket Per Node:
1 x LGA 4094
Total:
4 x LGA 4094
Socket SP3
Chipset System on Chip
Memory Per node:
8 x DIMM slots

Total:
32 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
Memory speed: Up to 3200 MHz
LAN Per node:
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
1 x Dedicated management port

Total:
8 x 1GbE LAN ports (1 x Intel® I350-AM2)
4 x Dedicated management ports
1 x 10/100/1000 *CMC global management port

*CMC: Chassis Management Controller, to monitor all status of computing nodes
Video Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Audio N/A
Storage Per node:
3 x3.5" SATA hot-swappable SSD bays

Total:
12 x 3.5" SATA hot-swappable SSD bays
RAID N/A
Peripheral Drives N/A
Expansion Slots Per node:
1 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus)
1 x Low profile half-length slots with PCIe x16 (Gen3 x16 bus)
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)

2 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports NGFF-2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device

Total:
4 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus)
4 x Low profile half-length slots with PCIe x16 (Gen3 x16 bus)
4 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)

8 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports NGFF-2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Internal I/O Per node:
2 x M.2 slot
1 x USB 3.0 header
1 x TPM header
1 x OCP 2.0 mezzanine slots
1 x Front panel header
1 x Back plane board header
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper
Front I/O Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED

Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
*1 x CMC status LED

*Only one CMC status LED per system
Rear I/O Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
*1 x CMC global management port

*Only one CMC global management port per system
Backplane I/O 12 x ports
Speed and bandwidth: SATA 6Gb/s per port
TPM 1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply 2 x 1600W redundant PSUs
80 PLUS Platinum

AC Input:
- 100-120V~/ 12A, 50-60Hz
- 200-240V~/ 10A, 50-60Hz

DC Output:
- Max 1000W/ 100-120V~
+12V/ 81.5A
+12Vsb/ 2.5A
- Max 1600W/ 200-240V or 240Vdc Input
+12V/ 133A
+12Vsb/ 2.5A
System Management Aspeed® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

  • Dashboard
  • JAVA Based Serial Over LAN
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility Windows Server 2016 ( X2APIC/256T not supported)
Windows Server 2019

Red Hat Enterprise Linux 7.6 ( x64) or later
Red Hat Enterprise Linux 8.0 ( x64) or later

SUSE Linux Enterprise Server 12 SP4 ( x64) or later
SUSE Linux Enterprise Server 15 SP1 ( x64) or later

Ubuntu 16.04.6 LTS (x64) or later
Ubuntu 18.04.3 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later

VMware ESXi 6.5 EP15 or later
VMware ESXi 6.7 Update3 or later
VMware ESXi 7.0 or later

Citrix Hypervisor 8.1.0 or later
Weight Net Weight: 27.3 kg
Gross Weight: 45.92 kg
System Fans 4 x 80x80x38mm (16,300rpm)
Operating Properties Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Ambient temperature limited to 30°C if using 280W CPU
Packaging Dimensions 1167 x 700 x 309 mm
Packaging Content 1 x H252-Z12
4 x CPU heatsinks
1 x Rail Kit
Part Numbers Barebone package: 6NH252Z12MR-00
Spare parts:
- Motherboard: 9MZ12HD0NR-00
- Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-44320J-A0R
- Back plane board: 9CBPH0C3NR-00
- Power Supply: 25EP0-216008-L0S
- Ring topology kit: 6NH262Z65SR-00-100 (optional extra)